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J. appl. oral sci ; 19(6): 662-667, Nov.-Dec. 2011. ilus, graf
Article in English | LILACS | ID: lil-610884

ABSTRACT

OBJECTIVES: The purpose of this study was to evaluate in situ the occurrence of corrosion in the soldering point areas between the wire, silver brazing and band in Haas expanders. MATERIAL AND METHODS: Thirty-four 7-12-year-old patients who needed maxillary expansion with a Haas expander were randomly assigned to two groups of 17 individuals each, according to the oral hygiene protocol adopted during the orthodontic treatment: Group I (control), toothbrushing with a fluoride dentifrice and Group II (experimental), toothbrushing with the same dentifrice plus 0.12 percent chlorhexidine gluconate (Periogard®) mouthrinses twice a week. The appliances were removed after approximately 4 months. Fragments of the appliances containing a metallic band with a soldered wire were sectioned at random for examination by stereomicroscopy, scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDS). Data were analyzed statistically by Fisher's test at 5 percent significance level. RESULTS: The analysis by optical microscopy revealed areas with color change suggestive of corrosion in the soldering point areas joining the band and the wire in all specimens of both groups, with no statistically significant difference between the groups (p=1). The peaks of chemical elements (Ni, Fe, Cr, O, C and P) revealed by EDS were also similar in both groups. CONCLUSION: Color changes and peaks of chemical elements suggestive of corrosion were observed in the soldering point areas between the wire, silver brazing and band in both control and experimental groups, which indicate that the 0.12 percent chlorhexidine gluconate mouthrinses did not influence the occurrence of corrosion in situ.


Subject(s)
Child , Female , Humans , Male , Anti-Infective Agents/chemistry , Corrosion , Orthodontic Appliances , Palatal Expansion Technique/instrumentation , Chlorhexidine/analogs & derivatives , Chlorhexidine/chemistry , Dental Soldering , Dental Alloys/chemistry , Microscopy, Electron, Scanning , Orthodontic Appliances/microbiology , Spectrometry, X-Ray Emission , Stainless Steel/chemistry , Time Factors
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